Lapping

Logitech PM5 Autolap

• Mechanical thinning of Dielectrics, Metals, Semiconductors and Polymers using 3 µm or 9 µm Alumina grain/DI-water suspension.
• In situ thickness and flatness control.
• Available lapping plates: Grooved and flat glass and cast-iron plates.
• Maximum sample sizes limited by 3’’ glass carrier.
• Different suspensions are applicable in accordance with the responsible and the Logitech company.
• Mechanical polishing of Metals and Semiconductors via polishing cloths using silicate suspension or diamond suspension/spray.
• Chemical reagents are applicable in accordance with the responsible and the Struers company.