Bonding

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wire bonder
Wire bonder creating an electrical contact on chip level.
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Wirebonder for Gold wire, Westbond 747677E

Responsibility:

Wirebonder for Gold wire
  • Wire wedge bonding of 25 mue Gold wires
  • Deep access tool for bonding in packages
  • Part size up to 200 x 200 mm2
  • Ribbon bonding tools for HF-applications (Option on request)
  • Heated workholder (2") for clamping plates and DIL-packages
  • Bonder and work place ESD (Electro Static Discharge) save for sensitive applications
  • Ionizer (fan) for neutralize static charges on surfaces / devices

Wirebonder for Aluminum wire, Westbond 7476E

Responsibility:

Wirebonder for Aluminium wire
  • Wedge bonding of 25 mue Aluminium wires
  • Deep access tool for bonding in packages
  • Part size up to 200 x 200 mm2
  • Heated workholder (50 x 50 mm2) for clamping plates and DIL-packages
  • Bonder and work place ESD (Electro Static Discharge) save for sensitive applications
  • Ionizer (fan) for neutralize static charges on surfaces / devices

Waferbonder AML AWD

Responsibility:

Waferbonder
  • Wafer aligning and bonding up to 4” wafer and smaller pieces (1/4 3" tooling also)
  • Maximum contact force 15000 N
  • Bonding in vacuum possible (chamber pressure < 1*10-5 mbar)
  • Max temperature: 560 °C
  • N2 purge gas
  • Automatic and manual operation possible

 

 

Anodic Bonder

Responsibility:

Anodic bonder
  • 3 and 4 inch hotplates – max temp ~400 °C
  • Up to 4 samples can be bonded simultaneously
  • Maximum voltage 2500 V (4 mA)
  • Current and temperature monitoring
 
 
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21.07.2017
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